Products

SOURCE GAS CABINETS AND SOURCE / VACUUM PUMP CABINETRS

Tarius Technology source and pump cabinets are known world-wide for excellence in quality, design and maintainability. Used as standard component of Tarius Furnace Processing Systems, theu may also be used to upgrade or convert processes on existing furnace systems (retrofit).


Source gas cabinets, which are a critical component of furnace systems, including pre-plumbing within a regulator module. Regulators, guages, isolation valves and filters are included in the module. the module is accessed through a clear-view door and it, along with the entire cabinet is fully evacuated. From each regulated gas supply, and orbitally-welded gas line then delivers the gas to associated gas systems at each tube-level.


Source cabinets are compartmentalized. Gas systems (tray/platters) are mounted vertically for easy access and view of all the components. A seperate section allows easy access to pricess tube and chambers connections. Co ntrol components are mounted to pull-out trays for easy cable connections and maintainability.


Liquid source bubbler systems, which reside at associated tube-levels, are mounted to moveable shelving. The bubbler system may be pulled out for easy access clearance and safery when changing and connecting ampoules.


For LPCVD processes, Tarius offers a variety of pump cabinets to suit most any facility requirement. The configuration of the cabinetry is determined by the available space and the size and componenets required for the vaccume systems. Pump cabinet configurations include:


  • Integrated source cabinet and stacked pump array (one pumping system per tube-level)
  • A high performance diffusion furnace.
  • Stand-alone stacked pump array (one pumping system tube-level)
  • Individual pump module for a tube-level

For each tube-level, pump cabinets include:

  • Pump (and Roots Blower A/R)
  • Vacuum control valves
  • Inline vacuum filtering
  • Oil recirculation/filtering when required
  • Vacuum lines and connections

For information of Tarius gas systems please click here.


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  • Semiconductor applications. 75 to 150mm diameter wafers.
  • 150 to 300 wafers per batch per tube-level
  • 30 in. (762mm) thermal flat zone
  • Cantilever, push/puller or manula loading
  • LPCVD or diffusion processing subsystems
  • 350 to 1350℃ temperature range
  • Integrated ASTRA Control System

  • Semiconductor applications. 100 to 150mm diameter wafers.
  • 200 to 400 wafers per batch per tube-level
  • 40 in. (1016mm) thermal flat zone
  • Cantilever, push/puller or manula loading
  • LPCVD or diffusion processing subsystems
  • 350 to 1350℃ temperature range
  • Integrated ASTRA Control System

  • Semiconductor applications. 200mm diameter wafers
  • 150 wafers per batch,typical
  • 36 in. (914.4mm) thermal flat zone
  • Cantilever loading
  • LPCVD or diffusion processing subsystems
  • 400℃ to 1300℃ temperature range
  • Integrated ASTRA Control System

  • Solar cell applications. Up to 125mm square or pseudo-square substrates.
  • 400 substrates per batch
  • LPCVD or diffusioihn processing subsystems
  • Preferred for POCl3 emitter diffusion
  • 400℃ to 1300℃ temperature range
  • Integrated ASTRA Control System

  • Solar cell applications. 156mm square or pseudo-square substances
  • 400 substrates per batch
  • Preferred for POCl3 emitter diffusion
  • 400℃ to 1300℃ temperature range
  • Integrated ASTRA Control System