Products

Available Processes

• Semiconductor • Photovolatics • MEMS • Nanotechnology
• III/V • LEDS

For information on processing subsystems please click here

Atmospheric Processes

75,100,125,200mm diameter wafers.

  • Dry oxidation
  • Dry oxidation with HCL enhancement
  • Dry oxidation with DCE enhancement
  • Pyrogenic oxidation, internal torch
  • Pyrogenic oxidation, external torch
  • Pyrogenic oxidation with HCL enhancement
  • Pyrogenic oxidation with DCE enhancement
  • DL:H2O bubbler oxidation
  • POCl3 phos dep liquid source doping
  • BBr3 boron dep liquid source doping
  • Solid source doping
  • H2 anneal/alloy
  • Forming gas anneal/alloy/sinter
  • Inert or noble gas anneal/alloy/sinter

LPCVD Processes

50,75,100,125, and 200mm diameter wafers.

  • Intrinsic polysilicon
  • Amorphous silicon
  • Phosphorous doped polysilicon
  • SiPOS (oxygen doped polysilicon)
  • Silicon nitrade (si3N4)
  • Low stress silicon nitride
  • Oxynitride
  • HTO
  • LTO
  • PSG
  • BPSG
  • TEOS
  • Doped TEOS

Most LPCVD processes are available with guaranteed process performace criteria. Please contact Taruius Associates for more information.

Custom and specialized LPCVD processes are reviewed upon request.

Photovoltaics

  • Emitter POCl3 phos dep
  • Thermal oxidation
  • LPCVD silicon nitride
  • Annealing
  • Applicable to 125mm and 156mm square and pseudo-square substrates

Most atmospheric processes are available with guaranteed process performace criteria. Please contact Tarius associates for more information.

Custom and specialized atmospheric processes are reviewed upon request.