• Semiconductor • Photovolatics • MEMS • Nanotechnology • III/V • LEDS
Processing subsystems are process-specific components that are installed at each tube-level of the furnace system. These may include the process tube or chamber, wafer carriers, the type of cantilever and injectors and baffles.
The size and form of the process tube or chamber has a direct effect on uniformity, growth or deposition rate and film quality. In addition, wafer boats, carriers and the cantilever or push/puller that reside in the chamber during processing may effect results. For certain atmospheric diffusion and LPCVD processes specialized gas and fluid injectors are required to properly distribute fluids and reactants.
An associated gas or fluid delivery system must be configured to properly and safely perform a specific process reaction. For LPCVD, proper vacuum pumps and vacuum control/monitoring devices must be implemented for effective process results and repeatability.
RCH Associates' processing subsystems include field-proven design features to assure the best process results avaialble. In addtion, keen attention is paid to how wafers are handled during loading and unloading. Another key benefit is the maintainability and rugged simplicity of the design, which results in the high uptime and performance you would expect.
The following lists provide overviews of typical processing subsystem components.