Products

AVAILABLE PROCESSES

• Semiconductor • Photovolatics • MEMS • Nanotechnology • III/V • LEDS

For information on processing subsystems please click here

75,100,125,200mm diameter wafers.

Dry oxidation
Dry oxidation with HCL enhancement
Dry oxidation with DCE enhancement
Pyrogenic oxidation, internal torch
Pyrogenic oxidation, external torch
Pyrogenic oxidation with HCL enhancement
Pyrogenic oxidation with DCE enhancement
DL:H₂O bubbler oxidation
POCl₃ phos dep liquid source doping
BBr₃ boron dep liquid source doping
Solid source doping
H₂ anneal/alloy
Forming gas anneal/alloy/sinter
Inert or noble gas anneal/alloy/sinter

Most atmospheric processes are available with guaranteed process performace criteria. Please contact Tarius associates for more information.

Custom and specialized atmospheric processes are reviewed upon request.

PHOTOVOLTAICS

Emitter POCl₃ phos dep
Thermal oxidation
LPCVD silicon nitride
Annealing
Applicable to 125mm and 156mm square and pseudo-square substrates

50,75,100,125, and 200mm diameter wafers.

Intrinsic polysilicon
Amorphous silicon
Phosphorous doped polysilicon
SiPOS (oxygen doped polysilicon)
Silicon nitrade (si₃N₄)
Low stress silicon nitride
Oxynitride
HTO
LTO
PSG
BPSG
TEOS
Doped TEOS

Most LPCVD processes are available with guaranteed process performace criteria. Please contact Taruius Associates for more information.

Custom and specialized LPCVD processes are reviewed upon request.

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