Products

AVAILABLE PROCESSES

• Semiconductor
• Photovoltaics
• MEMS
• Nanotechnology
• III/V
• LEDS




For information on processing subsystems please click here




75, 100, 125, 150, and 200mm diameter wafers.

  • Dry oxidation
  • Dry oxidation with HCl enhancement
  • Dry oxidation with DCE enhancement
  • Pyrogenic oxidation, internal torch
  • Pyrogenic oxidation, external torch
  • Pyrogenic oxidation with HCl enhancement
  • Pyrogenic oxidation with DCE enhancement
  • Dl:H2O bubbler oxidation
  • POCl3 phos dep liquid source doping
  • BBr3 boron dep liquid source doping
  • Solid source doping
  • H2 anneal/alloy
  • Forming gas anneal/alloy/sinter
  • Inert or noble gas anneal/alloy/sinter

Most atmospheric processes are available with guaranteed process performance criteria. Please contact Tarius Tecnology for more information.


Custom and specialized atmospheric processes are reviewed upon request.

  • Emitter POCl3 phos dep
  • Thermal oxidation
  • LPCVD silicon nitride
  • Annealing
  • Applicable to 125mm and 156mm square and pseudo-square substrates

Most atmospheric processes are available with guaranteed process performance criteria. Please contact Tarius Technology for information.


Custom and specialized atmospheric processes are reviewed upon request.

75,100,125, and 200mm diameter wafers.

  • Intrinsic polysilicon
  • Amorphous silicon
  • Phosphorous doped polysilicon
  • SiPOS (oxygen doped polysilicon)
  • Silicon nitride (Si3N4)
  • Low stress silicon nitride
  • Oxynitride
  • HTO
  • LTO
  • PSG
  • BPSG
  • TEOS
  • Doped TEOS

Most LPCVD processes are available with guaranteed process performance criteria. Please contact Tarius Technology for information.


Custom and specialized LPCVD processes are reviewed upon request.

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